Description
1. For Disassemble PCB Chips/Mobile Phone Frame
2. Heating plate with good and well-distributed heat conduction, will not be easy out of shape under high temperature
3. Thickened panel with pad
2. Heating plate with good and well-distributed heat conduction, will not be easy out of shape under high temperature
3. Thickened panel with pad
Specification:
| Package Weight |
|
Reviews
Wishlist
Wishlist is empty.
Compare
Shopping cart







