Buy 2 get free shipping ⋅ 14 day free returns ⋅ 2 year warranty
Description
1. A variety of models meet the needs of different scenarios for mobile phone repair
2. Ma1.0: pry to remove the glue from IC and CPU
3. Ma2.0: corner knife scraping IC peripheral glue
4. Ma3.0: special-shaped rubber tapping knife, cut vinyl without hurting the board
5. Ma4.0: prying IC hard disk
6. Ma5.0: prying CPU IC hard disk and CPU layering
7. Package includes:
2 x Knife Handle
5 x Blades
2. Ma1.0: pry to remove the glue from IC and CPU
3. Ma2.0: corner knife scraping IC peripheral glue
4. Ma3.0: special-shaped rubber tapping knife, cut vinyl without hurting the board
5. Ma4.0: prying IC hard disk
6. Ma5.0: prying CPU IC hard disk and CPU layering
7. Package includes:
2 x Knife Handle
5 x Blades
Specification:
Package Weight |
|
Reviews
Related Products
Recently viewed products
Copyright © BSPART. All Rights Reserved.
Shopping cart
close