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Description
1. The heatsink silicone pad can quickly fill electronic components, tiny gaps that rapidly conduct and dissipate heat generated by high-power CPUs/GPUs
2. High pressure and high temperature resistant safe and stable
3. Strong heat conduction and heat dissipation
4. Strong insulation and comprehensive protection
5. Escort for electronic equipment, excellent heat dissipation, worry-free insulation, suitable for Apple, Android phones, high-power LED modules, Integrated chips, and other scenarios
6. Size: 17x15x1.5mm
2. High pressure and high temperature resistant safe and stable
3. Strong heat conduction and heat dissipation
4. Strong insulation and comprehensive protection
5. Escort for electronic equipment, excellent heat dissipation, worry-free insulation, suitable for Apple, Android phones, high-power LED modules, Integrated chips, and other scenarios
6. Size: 17x15x1.5mm
Specification:
Package Weight |
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