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Description
1. For Disassemble PCB Chips/Mobile Phone Frame
2. Heating plate with good and well-distributed heat conduction, will not be easy out of shape under high temperature
3. Thickened panel with pad
2. Heating plate with good and well-distributed heat conduction, will not be easy out of shape under high temperature
3. Thickened panel with pad
Specification:
Package Weight |
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