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Description
1. Free of hot air gun and soldering iron, easy to operate
2. Rapid temperature rise, preset 160℃-250℃ temperature range, one-button adjustment
3. Concealed screw, low voltage heating plate, support 5V/9V power supply
4. Aluminum substrate heat conduction is faster and more efficient
5. It is suitable for removing glue and tin from CPU, RAM, eMMC, SSD, WiFi, and other chips
6. Compact and portable, easy to use
2. Rapid temperature rise, preset 160℃-250℃ temperature range, one-button adjustment
3. Concealed screw, low voltage heating plate, support 5V/9V power supply
4. Aluminum substrate heat conduction is faster and more efficient
5. It is suitable for removing glue and tin from CPU, RAM, eMMC, SSD, WiFi, and other chips
6. Compact and portable, easy to use
Specification:
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