Descripción
1. Perfectly compatible with 861DW and 861DS hot air desoldering stations, high compatibility.
2. Bent nozzle does not obstruct the view, suitable for fine-tuning repair work under a microscope.
3. Multiple nozzle diameters (4/5/6/8/10/12mm), small diameter nozzles provide concentrated and precise temperature, suitable for micro-components.
4. One-piece molded structure, direct plug-and-play installation, tight-sealed interface to prevent air leakage, stable and uniform hot air output.
5. High temperature resistant, smooth airflow channel, durable and not easily deformed, suitable for long-term motherboard repair use.
6. Suitable for desoldering and resoldering mobile phone motherboards, BGA chips, and integrated circuits.
2. Bent nozzle does not obstruct the view, suitable for fine-tuning repair work under a microscope.
3. Multiple nozzle diameters (4/5/6/8/10/12mm), small diameter nozzles provide concentrated and precise temperature, suitable for micro-components.
4. One-piece molded structure, direct plug-and-play installation, tight-sealed interface to prevent air leakage, stable and uniform hot air output.
5. High temperature resistant, smooth airflow channel, durable and not easily deformed, suitable for long-term motherboard repair use.
6. Suitable for desoldering and resoldering mobile phone motherboards, BGA chips, and integrated circuits.
Specification:
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