Description
1. 0.12mm precision stencil designed for middle-layer BGA reballing.
2. Designed for professional smartphone repair applications, helping technicians perform motherboard middle-layer reballing more efficiently.
3. Suitable for motherboard middle-layer BGA reballing and soldering rework, supporting professional chip and logic board repair tasks.
4. Features a precision aperture layout designed to match the corresponding solder pad pattern, helping guide solder paste or solder ball placement during reballing.
5. Specifically designed for iPhone 18 Pro / iPhone 18 Pro Max.
2. Designed for professional smartphone repair applications, helping technicians perform motherboard middle-layer reballing more efficiently.
3. Suitable for motherboard middle-layer BGA reballing and soldering rework, supporting professional chip and logic board repair tasks.
4. Features a precision aperture layout designed to match the corresponding solder pad pattern, helping guide solder paste or solder ball placement during reballing.
5. Specifically designed for iPhone 18 Pro / iPhone 18 Pro Max.
Specification:
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